thermal compound has been one of the staples of modern pc's single the dawning of the millenium its been cooling cpu's the world over. today sony's chemical R&D division debuted a paper thin sheet which has already started setting paces matching (or beating) many of the generic compounds pre-builts use (even their own) by a degree or two.
cpu 0 is being cooled by the same compound sony uses in its laptops
cpu1 is being cooled by their sheet
the sheet also has longer lifespan than compound
http://techon.nikkeibp.co.jp/english/NEWS_EN/20120714/228452/
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