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Wondering if i did it right drives me insane, Ive re-mounted at least 10 times now, and im still thinking about re doing it.
for c2d the best i found is the razor blade method to the base of the HeatSink.
Durring all this I've also learned that not enough is far worse than too much. (heat wize)
[QUOTE="Random__Guy"]Durring all this I've also learned that not enough is far worse than too much. (heat wize)LordEC911
Depending on the condition of your IHS, concave or not, this is not true.
Less is almost always better.
If you put too much in, it's just gonna end up getting squashed out the sides.
[QUOTE="LordEC911"][QUOTE="Random__Guy"]Durring all this I've also learned that not enough is far worse than too much. (heat wize)Random__Guy
Depending on the condition of your IHS, concave or not, this is not true.
Less is almost always better.
If you put too much in, it's just gonna end up getting squashed out the sides.
Once of my friend's HS and CPU was smeared with thermal paste that it seep out and went all over the CPU socket and motherboard, the store he took it to to build it seems to have not idea how to apply it
[QUOTE="LordEC911"][QUOTE="Random__Guy"]Durring all this I've also learned that not enough is far worse than too much. (heat wize)Random__Guy
Depending on the condition of your IHS, concave or not, this is not true.
Less is almost always better.
If you put too much in, it's just gonna end up getting squashed out the sides.
Yes but the thicker it is, the harder it is for the heat to be transferred, aka resistance. That is why people say to spread it out as thin as possible.
[QUOTE="Random__Guy"][QUOTE="LordEC911"][QUOTE="Random__Guy"]Durring all this I've also learned that not enough is far worse than too much. (heat wize)LordEC911
Depending on the condition of your IHS, concave or not, this is not true.
Less is almost always better.
If you put too much in, it's just gonna end up getting squashed out the sides.
Yes but the thicker it is, the harder it is for the heat to be transferred, aka resistance. That is why people say to spread it out as thin as possible.
Ya thinest is the best, but i think with too much at least your getting complete contact, not enough and you could end up with only a tiny contact point and alot of air.
Ya thinest is the best, but i think with too much at least your getting complete contact, not enough and you could end up with only a tiny contact point and alot of air.Random__Guy
If both your IHS and HS are flat, there is practically no need for TiP other then to fill the microscopic gaps/grooves which is why just hazing the surfaces with TiP offers great thermal performance.
I use the finger in the inverted plastic bag and latex glove.
but since the thermalright ultra 120 extreme base wasn't flat, I couldn't have used ac5 or zm-stg1 because theey bleed easily. So I used the thermalrights paste, and the finger method wouldn't work I had to get a brush from the zm-stg1 cleaned it thoroughly, I still have to lap my heatsink though, which will take quite a while, not to mention the driving time to get sand paper.
When I was using the finger method with thethermalright paste it kept coming off the cpu, and going everywhere on my motherboard.... I had to get 5 q tips to clean the motherboard...
I just put about a blob of about 1.5mm x 1.5mm x 1.5mm
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