Samsung's 14LPP fabs has been mass producing Exynos 8890 since late 2015.
References
From http://www.anandtech.com/show/9959/samsung-announces-14lpp-mass-production
The 14LPP process is confirmed to be used in Samsung LSI's own Exynos 8890
From http://www.anandtech.com/show/9781/samsung-announces-exynos-8890-with-cat1213-modem-and-custom-cpu
Exynos 8890 is announced to enter mass production in late 2015
We have different definitions of "new" lol. Either way, that's still too new for Nintendo. Wii U used a GPU from 2008 on TSMC's 40nm process from 2008, and don't get me started on that CPU... NX development started in 2014, so that's the latest we should look in terms of tech. It's backwards and potentially suicidal... but, it's Nintendo. It's how they roll. If we're lucky, the might go with Tonga and be 50% faster than PS4, but that's probably too big of a chip.
Tonga is a large chip with 366 mm^2 area size. Think about it.
Xbox 360 wasn't that crazy with 366 mm^2 allocated just the GPU i.e. Xenos's chip size is 182 mm^2. Xbox One's GPU area size is about 160 mm^2 (similar to 7790).
Mobile Tonga XT's 95 watts TDP is OK for PS4 type cooling solution, but it's a large chip for a game console GPU.
Right, which is why I doubt it and realistically think we'll get a 1280SP (20CU) GCN 1.2 part (basically Pitcairn updated to GCN 1.2) in the absolute best case, but a 640-768 (10-12CU) GCN 1.1 part in the most likely case, on 28nm in any case. I know you'll bring up cost, but 28nm was cheaper than 40nm in the ways that you're describing in 2012. Nintendo doesn't care. You've also consistently ignored my arguments about yields, so I have to ask... Do you know what I'm talking about when I mention yields? You seem to think that it's directly related to cost since that's what you tend to reply with when I mention it.
Both Polaris 11 and 10 are targeted for mainstream market segments hence yields should be pretty good.
During 28nm year 2012, AMD focused on high end 7979 ASIC with 3 SKUs i.e. 7970 (32 CU) , 7950 (28 CU, 4 CU failed) and 7870 XT (24 CU, 8 CU failed). After yields has improved, AMD introduced mainstream 7770 and 7870. For 28 nm TSMC, AMD was the risk partner. For Samsung 14 FinFET, AMD is not a risk partner.
Wii as also a node behind the new one; in fact, even PS3 was on 90nm even though 65nm was available. I'll say that Nintendo might go with 14nmFF if NX launches in 2017, but not this year. It's also why I don't expect PS4k or XB1.5 until Spring 2017.
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